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Flip Chip Product Manager

Company: Kforce Technology
Location: Chandler
Posted on: June 24, 2022

Job Description:

RESPONSIBILITIES:Kforce's client, a small to medium size Semiconductor company in Chandler, AZ is seeking a Senior Product Manager for our Flip Chip Packaging Assembly product line. We are working directly with the Hiring Manager on this exclusive search assignment. The company offers a competitive compensation package including base salary, annual bonus, etc. This position includes product management and direct customer interactions for new product development, qualification, and mass production of advanced flip chip products. This position does not have any direct reports. Responsibilities:

  • Daily application of detailed knowledge of semiconductor packaging assembly and substrate technologies across many concurrent development/NPI programs
  • Driving customer requirements and timelines to multiple SEA factories
  • Deep diving into root cause failure analysis and clearing obstacles with product design, reliability, and manufacturability issues
  • Performing and analyzing detailed cost modeling for providing product level assembly pricing
  • This role combines deep technical knowledge, project management, strategic planning, tactical execution, customer satisfaction control, business sense, and negotiation skill
  • Work closely with suppliers to identify capabilities and capacities for all key processes and material sets (ABF, uBall, stacked vias, Coreless, etc.)
  • Responsibility for substrate technology path finding and roadmap execution
  • Direct interface with suppliers and factory engineers for new substrate development and qualification
  • Drive substrate suppliers to meet technology requirements and timelines
  • Align on Technology Roadmaps and drive flip chip priorities
  • Assist/lead to resolve substrate quality issues at suppliers and factories Job Requirements:REQUIREMENTS:
    • BS/MS degree in Mechanical, Chemical, Materials, Electrical engineering or other related
    • 10+ years of experience in the semiconductor industry
    • Technical Project Management experience (preferably, involving offshore factories) and the ability to collaborate across numerous programs and teams
    • Ability to work independently
    • Ability to overcome obstacles and assume ownership of program success
    • Solid knowledge of semiconductor packaging design, materials, substrates, manufacturing methods and various flip chip package form factors
    • Excellent written and verbal communication skills
    • Frequent face to face and teleconference technical presentations to customers is required
    • Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required Preferred Qualifications:
      • PMP certified project management also a plus
      • Hands on manufacturing/technical experience is a big plus
      • Experience with cost modeling, pricing, quoting activities and products would be beneficial
      • Knowledge of material and package characterization data analysis, reliability test methods and qualification procedures are desired
      • Experience/knowledge of flip chip packaging failure analysis methods is desired
      • Familiarity with Design of Experiments and Statistical Process Control (JMP) is a plus
      • Willing and able to travel 15% domestic and 15% internationally Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.

Keywords: Kforce Technology, Chandler , Flip Chip Product Manager, Executive , Chandler, Arizona

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