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Sr Packaging Engineer

Company: NXP Semiconductors
Location: chandler
Posted on: May 3, 2021

Job Description:

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019. Business Unit Description NXPs Technology organization plays an essential role in the companys success by ensuring the delivery of high quality, scalable, cost-competitive technologies and supply to create a competitive advantage for our customers. Package Innovation delivers IC packaging solutions and new packaging technology for all NXP products. Within Package Innovation, the Automotive Systems team provides packaging for a range of products including Vehicle Electrification, Power Management, Sensors, ADAS, and Car Audio. Job Summary: - Responsible for leading packaging projects ensuring that all packaging deliverables are met for New Product and New Technology Introductions (NPI, NTI). - Define packages and materials that meet product requirements for reliability, performance, manufacturability, and cost. - Develop DOEs and tests to evaluate suitability and reliability of package solutions. - Coordinate package related activities across multiple organizations including Marketing, Design, Applications, Test, Assembly Engineering, Quality, and Manufacturing (internal and external factories). - Address and solve materials and processing issues that may occur during the development process. - Manage the package process using industry standard project management tools. Job Qualifications: - B.S. or M.S. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or related field. - 10+ years experience in microelectronics packaging development or related field required. - Team player with positive attitude, self-driven proactive mindset, and innovative outlook. - Excellent communication and presentation skills (written and verbal) are required. - Demonstrated experience with IC packages such as QFP, QFN, BGA, flip chip, wafer level packaging (FO, WLCSP). - Demonstrated experience in Statistical Analysis and Design of Experiment is a plus. - Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally. NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

Keywords: NXP Semiconductors, Chandler , Sr Packaging Engineer, Other , chandler, Arizona

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