ChandlerRecruiter Since 2001
the smart solution for Chandler jobs

Sr Packaging Engineer

Company: NXP Semiconductors
Location: chandler
Posted on: May 3, 2021

Job Description:

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019. Business Unit Description NXPs Technology organization plays an essential role in the companys success by ensuring the delivery of high quality, scalable, cost-competitive technologies and supply to create a competitive advantage for our customers. Package Innovation delivers IC packaging solutions and new packaging technology for all NXP products. Within Package Innovation, the Automotive Systems team provides packaging for a range of products including Vehicle Electrification, Power Management, Sensors, ADAS, and Car Audio. Job Summary: - Responsible for leading packaging projects ensuring that all packaging deliverables are met for New Product and New Technology Introductions (NPI, NTI). - Define packages and materials that meet product requirements for reliability, performance, manufacturability, and cost. - Develop DOEs and tests to evaluate suitability and reliability of package solutions. - Coordinate package related activities across multiple organizations including Marketing, Design, Applications, Test, Assembly Engineering, Quality, and Manufacturing (internal and external factories). - Address and solve materials and processing issues that may occur during the development process. - Manage the package process using industry standard project management tools. Job Qualifications: - B.S. or M.S. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or related field. - 10+ years experience in microelectronics packaging development or related field required. - Team player with positive attitude, self-driven proactive mindset, and innovative outlook. - Excellent communication and presentation skills (written and verbal) are required. - Demonstrated experience with IC packages such as QFP, QFN, BGA, flip chip, wafer level packaging (FO, WLCSP). - Demonstrated experience in Statistical Analysis and Design of Experiment is a plus. - Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally. NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

Keywords: NXP Semiconductors, Chandler , Sr Packaging Engineer, Other , chandler, Arizona

Click here to apply!

Didn't find what you're looking for? Search again!

I'm looking for
in category

Log In or Create An Account

Get the latest Arizona jobs by following @recnetAZ on Twitter!

Chandler RSS job feeds