3D NAND TD Principle Engineer (Expat to Dalian)
Company: Intel Corp.
Location: Chandler
Posted on: June 8, 2021
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Job Description:
3D NAND TD Principle Engineer (Expat to Dalian) Job Description Intel Dalian is rapidly expanding its 3D NAND Dalian Technology
Development (DTD) organization to develop future generations of 3D
NAND process technologies. This job requisition is to seek an experienced candidate to lead
the 3D NAND process development organization based in Dalian,
China, reporting to the Sr. Director of Dalian Technology
Development. The selected candidate will partner with the Dalian
high volume manufacturing organization and Intel memory technology
development teams in the US to create leading edge 3D NAND process
technology. The candidate must have technology development experience and
demonstrated leadership skills in a large organization, as a
manager of managers, including but not limiting to safety,
technology, quality, output, and cost. The selected candidate will
lead and develop the process technology development organizations
including photolithography, dry etch, thin films, metrology, CMP
and Wet Process. Candidate is responsible for defining and
executing to the NAND TD roadmap, resource planning activities,
organization and leadership development to grow the organizational
technical capability. The candidate must have demonstrated the ability to solve highly
complex technical problems with excellent communication skills and
the ability to motivate the organization. The candidate must also
have demonstrated strong ethical standards and be able to set the
tone from the top. Must also be able to lead in a highly ambiguous
and dynamic business environment. Dalian Memory Technology and Manufacturing (DMTM) in Intel's
Non-Volatile Memory Technology Development Group is looking for
Process Engineering Technology Development experts and leaders to
drive and develop future generations of 3D NAND technology. This
requisition is targeting candidates to fill multiple positions
available based in Dalian, China. The ideal candidates should have a successful track record of
delivering leading edge process capability and demonstrated
collaboration with cross-functional/cross-company teams including
equipment and material vendors. Internal candidates from USA or other international sites can be
qualified for two-way expatriate assignments in Dalian, China. Following positions are currently available: Qualifications Depending on the role, selected candidates might assume some or
all of the following job responsibilities: Defining roadmaps to meet requirements, goals and milestones for
a new technology process. Defining and establishing flow, procedures, and equipment
configuration for the module. Selecting and developing material and equipment for the process
to meet quality, reliability, cost, yield, productivity and
manufacturability requirements. Leading and conducting process, equipment and material
development projects with equipment and material suppliers Designing, executing and analyzing experiments necessary to meet
engineering specifications for their process. Working effectively with the equipment supplier to identify
shortcomings, propose and evaluate hardware modification to
mitigate issues. Driving improvements on quality, reliability, cost, yield,
process stability/capability, productivity and safety/ergonomic
over variables such as material, method, equipment, environment and
operating personnel. Developing solutions to problems utilizing scientific
fundamentals, statistical knowledge, and problem-solving tools. Establishing process control systems for the process module.
Training production/receiving process engineers in high volume
factories. Transferring processes to high volume manufacturing and
providing support in new factory startup. This position is associated with the sale of Intel's NAND memory
and storagebusiness to SK Hynix (You can read more about the
transaction in the press release -
https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memory-news-q-a.pdf).
The transaction will enhance the resources and potential of the
business' storage solutions, including client and enterprise SSDs,
in the rapidly growing NAND Flash space amid the era of big
data. This is an exciting time to be at Intel - come join our NAND-DTM
and work on the most advanced 3DNAND and SSD technology in the
world. As the global leader in the semiconductor industry, Intel
possesses industry-leading SSD technology and the most capable
Quadruple Level Cell (QLC) NAND Flash products, and you will be
part of a world-class team that will transition to lead the SSD
business at SK Hynix. This position aligns to Phase 2 of the transaction, which
includes NAND technology and component development along with fab
operations. Employees aligned to Phase 2 will continue to be
employed by Intel and will continue to develop NAND technology and
components and manufacture NAND wafers at the fab. Phase 2 of the
transaction is expected to close in March 2025, at which time
employees aligned to this phase of the transaction will transition
employment to SK Hynix. Inside this Business Group Non-Volatile Solutions Memory Group: The Non-Volatile Memory
Solutions Group is a worldwide organization that delivers NAND
flash memory products for use in Solid State Drives (SSDs),
portable memory storage devices, digital camera memory cards, and
other devices. The group is responsible for NVM technology design
and development, complete Solid State Drive (SSD) system hardware
and firmware development, as well as wafer and SSD
manufacturing. Other Locations PRC, Dalian; Posting Statement All qualified applicants will receive consideration for
employment without regard to race, color, religion, religious
creed, sex, national origin, ancestry, age, physical or mental
disability, medical condition, genetic information, military and
veteran status, marital status, pregnancy, gender, gender
expression, gender identity, sexual orientation, or any other
characteristic protected by local law, regulation, or
ordinance. Position of Trust This role is a Position of Trust. Should you accept this
position, you must consent to and pass an extended Background
Investigation, which includes (subject to country law), extended
education, SEC sanctions, and additional criminal and civil checks.
For internals, this investigation may or may not be completed prior
to starting the position. For additional questions, please contact
your Recruiter.... Annual Salary Range for jobs which could be performed in US,
Colorado: $146,140.00-$255,950.00 Benefits: We offer a total compensation package that ranks among the best
in the industry. It consists of competitive pay, stock, bonuses,
and benefit programs. Find more information about our Amazing
Benefits here USJR0165479Chandler
Keywords: Intel Corp., Chandler , 3D NAND TD Principle Engineer (Expat to Dalian), Other , Chandler, Arizona
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